52

Das binäre System Aluminium-Zinn

Year:
1913
Language:
german
File:
PDF, 122 KB
german, 1913
54

A comparison of crack initiation techniques for ceramics

Year:
1995
Language:
english
File:
PDF, 1.09 MB
english, 1995
55

Organisation of theEscherichia colichromosome between genesglnSandglnU, V

Year:
1987
Language:
english
File:
PDF, 288 KB
english, 1987
59

High-strain fatigue of Pb-Sn eutectic solder alloy

Year:
1996
Language:
english
File:
PDF, 1.12 MB
english, 1996
60

Fatigue crack growth in plate specimens under Mode III loading

Year:
1985
Language:
english
File:
PDF, 2.02 MB
english, 1985
61

Solders in electronics

Year:
1996
Language:
english
File:
PDF, 1.99 MB
english, 1996
64

The creep of lead-free solders at elevated temperatures

Year:
2001
Language:
english
File:
PDF, 1.23 MB
english, 2001
66

Damage produced in model solder (Sn-37Pb) joints during thermomechanical cycling

Year:
2003
Language:
english
File:
PDF, 1.37 MB
english, 2003
67

Creep properties of Sn-8Mass%Zn-3Mass%Bi lead-free alloy

Year:
2004
Language:
english
File:
PDF, 138 KB
english, 2004
68

Damage Produced in Solder Alloys during Thermal Cycling

Year:
2007
Language:
english
File:
PDF, 763 KB
english, 2007
69

Recent Observations on Tin Pest Formation in Solder Alloys

Year:
2008
Language:
english
File:
PDF, 293 KB
english, 2008
71

Further Observations on Tin Pest Formation in Solder Alloys

Year:
2010
Language:
english
File:
PDF, 433 KB
english, 2010
72

Mechano-environmental effects in fatigue

Year:
1977
Language:
english
File:
PDF, 825 KB
english, 1977
74

Crack Healing in a Silicon Nitride Ceramic

Year:
1998
Language:
english
File:
PDF, 1.60 MB
english, 1998
97

Vacancy decay at — 21.3°C in quenched aluminium-indium alloys

Year:
1970
Language:
english
File:
PDF, 85 KB
english, 1970
98

Residual stress effects during fatigue crack growth

Year:
1985
Language:
english
File:
PDF, 185 KB
english, 1985