Properties and reliability of liquid epoxy resin for LSI...

Properties and reliability of liquid epoxy resin for LSI fabrication with the printing encapsulation system (PES)

Atsushi Okuno, Noriko Fujita, Koichiro Nagai, Noritaka Oyama, Tsunekazu Hashimoto
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Volume:
80
Year:
1997
Pages:
10
DOI:
10.1002/(sici)1520-6432(199702)80:23.0.co;2-5
File:
PDF, 1.12 MB
1997
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