Properties and reliability of liquid epoxy resin for LSI fabrication with the printing encapsulation system (PES)
Atsushi Okuno, Noriko Fujita, Koichiro Nagai, Noritaka Oyama, Tsunekazu HashimotoVolume:
80
Year:
1997
Pages:
10
DOI:
10.1002/(sici)1520-6432(199702)80:23.0.co;2-5
File:
PDF, 1.12 MB
1997