Fabrication of discretep-njunctions separated by an...

Semiconductors 1999 / 07 Vol. 33; Iss. 7

Fabrication of discretep-njunctions separated by an insulating layer using direct wafer bonding

E. G. Guk, B. G. Podlaskin, N. A. Tokranova, V. B. Voronkov, V. A. Kozlov
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Volume:
33
Language:
english
Pages:
6
DOI:
10.1134/1.1187787
Date:
July, 1999
File:
PDF, 144 KB
english, 1999
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