Simulation of the transient temperature distribution in a high-power semiconductor device cooling apparatus using heat pipes
Osamu Suzuki, Kazumasa Fujioka, Heikichi Kuwahara, Toshio TakasakiVolume:
26
Year:
1997
Pages:
9
DOI:
10.1002/(sici)1520-6556(1997)26:23.0.co;2-#
File:
PDF, 541 KB
1997