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Grain Boundary Resistivity and Electrically Induced Grain Boundary Migration (EIGM) in Metallic Bamboo Microstructures
Rand Dannenberg, Alexander H. KingVolume:
7
Language:
english
Pages:
12
DOI:
10.1023/a:1008778113938
Date:
May, 1999
File:
PDF, 115 KB
english, 1999