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Diffusion barrier properties of electroless Ni for electroless Cu using Cu plating employing hypophosphite as a reducing agent
CHWAN-YING Lee, TZUEN-HSI Huang, SHING-CHI LuVolume:
9
Language:
english
Pages:
10
DOI:
10.1023/a:1008977002472
Date:
October, 1998
File:
PDF, 2.26 MB
english, 1998