Dielectric properties of epoxy/silica composites used for...

Journal of Materials Science: Materials in Electronics 2001 / 02 Vol. 12; Iss. 2

Dielectric properties of epoxy/silica composites used for microlectronic packaging, and their dependence on post-curing

P. Gonon, A. Sylvestre, J. Teysseyre, C. Prior
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Volume:
12
Language:
english
Pages:
6
DOI:
10.1023/a:1011241818209
Date:
February, 2001
File:
PDF, 154 KB
english, 2001
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