Surface electromigration of sputtered copper patterned...

Journal of Materials Science: Materials in Electronics 2001 / 06 Vol. 12; Iss. 4-6

Surface electromigration of sputtered copper patterned using ion milling or chemical mechanical polishing

B. H. W. Toh, N. D. McCusker, D. W. McNeill, H. S. Gamble, V. Len
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Volume:
12
Language:
english
Pages:
6
DOI:
10.1023/a:1011288110082
Date:
June, 2001
File:
PDF, 904 KB
english, 2001
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