Study of the mechanism of additives on copper dissolution...

Study of the mechanism of additives on copper dissolution in monoethanolamine-complexed cupric ion solution

C-W. Shih, Y-Y. Wang, C-C. Wan
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Volume:
32
Language:
english
Pages:
6
DOI:
10.1023/a:1020939319057
Date:
September, 2002
File:
PDF, 238 KB
english, 2002
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