Thickness effect on grain growth and precipitate coarsening...

Journal of Materials Science: Materials in Electronics 2003 / 02 Vol. 14; Iss. 2

Thickness effect on grain growth and precipitate coarsening of a copper-silver thin film in an advanced metallization process

Y. K. Ko, J. H. Jang, S. Lee, H. J. Yang, W. H. Lee, J. G. Lee, P. J. Reucroft
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Volume:
14
Language:
english
Pages:
6
DOI:
10.1023/a:1021956703967
Date:
February, 2003
File:
PDF, 936 KB
english, 2003
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