Microstructural effects on the behavior of Sn–Ag solder...

Journal of Materials Science: Materials in Electronics 2003 / 03 Vol. 14; Iss. 3

Microstructural effects on the behavior of Sn–Ag solder joints under repeated reverse stressing

K. J. Ferguson, A. Telang, J. G. Lee, K. N. Subramanian
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Volume:
14
Language:
english
Pages:
8
DOI:
10.1023/a:1022353923999
Date:
March, 2003
File:
PDF, 2.64 MB
english, 2003
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