[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical &...

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[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems -

Brinkfeldt, Klas, Formanek, Jan, Laposa, Alexander, Jakovenko, Jiri, Adolfsson, Erik, Johander, Per
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Year:
2012
Language:
english
Pages:
5
DOI:
10.1109/esime.2012.6191730
File:
PDF, 1.03 MB
english, 2012
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