Stress reduction and bond stability during thermal...

Journal of Applied Physics 1999 Vol. 85; Iss. 10

Stress reduction and bond stability during thermal annealing of tetrahedral amorphous carbon

Ferrari, A. C., Kleinsorge, B., Morrison, N. A., Hart, A., Stolojan, V., Robertson, J.
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Volume:
85
Year:
1999
Language:
english
DOI:
10.1063/1.370531
File:
PDF, 384 KB
english, 1999
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