Data mining for improving the solder bumping process in the...

Data mining for improving the solder bumping process in the semiconductor packaging industry

Chen-fu Chien, Huan-chung Li, Angus Jeang
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Volume:
14
Year:
2006
Language:
english
Pages:
15
DOI:
10.1002/isaf.273
File:
PDF, 343 KB
english, 2006
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