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A study of electromigration in 3-D flip Chip Solder joint using numerical Simulation of heat flux and current density
Lee, T.-Y.T., Taek-Yeong Lee, King-Ning TuVolume:
27
Year:
2004
Language:
english
Pages:
8
DOI:
10.1109/tcapt.2004.831774
File:
PDF, 2.32 MB
english, 2004