![](/img/cover-not-exists.png)
Mesoporous SiO2 as low-k dielectric for integration in Cu/low-k interconnect systems
Swantje Frühauf, Stefan E. Schulz, Thomas GessnerVolume:
18
Year:
2006
Language:
english
Pages:
6
DOI:
10.1002/vipr.200690028
File:
PDF, 353 KB
english, 2006