Microstructure and hardness of copper powder consolidated by plasma pressure compaction
T. S. Srivatsan, B. G. Ravi, A. S. Naruka, L. Riester, S. Yoo, T. S. SudarshanVolume:
10
Language:
english
Pages:
7
DOI:
10.1361/105994901770344872
Date:
August, 2001
File:
PDF, 187 KB
english, 2001