Tensile behavior of commercially pure copper sheet fabricated by 2-and 3-layered accumulative roll bonding (ARB) process
Younghwan Jang, Sangshik Kim, Seungzeon Han, Chayong Lim, Masahiro GotoVolume:
14
Language:
english
Pages:
5
DOI:
10.3365/met.mat.2008.04.171
Date:
April, 2008
File:
PDF, 290 KB
english, 2008