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Adhesive Selection and Bonding Parameter Optimization for Hybrid Bonding in 3D Integration
Chen, Kuan-Neng, Ko, Cheng-Ta, Hsiao, Zhi-Cheng, Fu, Huan-Chun, Lo, Wei-ChungVolume:
12
Language:
english
Pages:
8
Journal:
Journal of Nanoscience and Nanotechnology
DOI:
10.1166/jnn.2012.5176
Date:
March, 2012
File:
PDF, 2.09 MB
english, 2012