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[IEEE 2009 IEEE Workshop on Signal Propagation on Interconnects (SPI) - Strasbourg, France (2009.05.12-2009.05.15)] 2009 IEEE Workshop on Signal Propagation on Interconnects - High frequency characterization and modeling of high density TSV in 3D integrated circuits
Bermond, C., Cadix, L., Farcy, A., Lacrevaz, T., Leduc, P., Flechet, B.Year:
2009
Language:
english
Pages:
4
DOI:
10.1109/spi.2009.5089840
File:
PDF, 295 KB
english, 2009