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Tungsten Through-Silicon Via Technology for Three-Dimensional LSIs
Kikuchi, Hirokazu, Yamada, Yusuke, Ali, Atif Mossad, Liang, Jun, Fukushima, Takafumi, Tanaka, Tetsu, Koyanagi, MitsumasaVolume:
47
Year:
2008
Language:
english
Pages:
6
DOI:
10.1143/jjap.47.2801
File:
PDF, 700 KB
english, 2008