![](/img/cover-not-exists.png)
[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - A physics-based model of on-chip decoupling capacitor for accurate power integrity analysis
Yu-Jen Cheng,, Hao-Hsiang Chuang,, Chun Hsia,, Wen-Wei Chen,, Wen-Po Huang,, Tzong-Lin Wu,Year:
2011
Language:
english
Pages:
4
DOI:
10.1109/edaps.2011.6213773
File:
PDF, 359 KB
english, 2011