[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou, China (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - A 60-GHz band WPAN transmitter module integrated with a planar dipole antenna using organic substrates and 3-D SiP technology
Yoshida, Satoshi, Tanifuji, Shoichi, Kameda, Suguru, Suematsu, Noriharu, Takagi, Tadashi, Tsubouchi, KazuoYear:
2011
Language:
english
Pages:
4
DOI:
10.1109/edaps.2011.6213759
File:
PDF, 504 KB
english, 2011