Mechanical Strength of Silicon Wafers Cut by Loose Abrasive...

Mechanical Strength of Silicon Wafers Cut by Loose Abrasive Slurry and Fixed Abrasive Diamond Wire Sawing

Hao Wu, Shreyes N. Melkote, Steven Danyluk
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Volume:
14
Year:
2012
Language:
english
Pages:
7
DOI:
10.1002/adem.201100263
File:
PDF, 569 KB
english, 2012
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