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Mechanical Strength of Silicon Wafers Cut by Loose Abrasive Slurry and Fixed Abrasive Diamond Wire Sawing
Hao Wu, Shreyes N. Melkote, Steven DanylukVolume:
14
Year:
2012
Language:
english
Pages:
7
DOI:
10.1002/adem.201100263
File:
PDF, 569 KB
english, 2012