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Direct formation of solder bump on Al pad using ultrasonic soldering
Michihiko Inaba, Nobuo Iwase, Seiichi Hirata, Makoto Gonda, Yasuhiro ImaiVolume:
71
Year:
1988
Language:
english
Pages:
8
DOI:
10.1002/ecjb.4420711004
File:
PDF, 550 KB
english, 1988