Direct formation of solder bump on Al pad using ultrasonic...

Direct formation of solder bump on Al pad using ultrasonic soldering

Michihiko Inaba, Nobuo Iwase, Seiichi Hirata, Makoto Gonda, Yasuhiro Imai
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Volume:
71
Year:
1988
Language:
english
Pages:
8
DOI:
10.1002/ecjb.4420711004
File:
PDF, 550 KB
english, 1988
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