Mechanical property enhancement of non-bonding electrospun mats via adhesive
Woo-Il Baek, Hem Raj Pant, R. Nirmala, Ki-Taek Nam, Hyun-Ju Oh, Hak-Yong KimVolume:
61
Year:
2012
Language:
english
Pages:
6
DOI:
10.1002/pi.4153
File:
PDF, 321 KB
english, 2012