Failure analysis of encapsulated electronic devices by...

Failure analysis of encapsulated electronic devices by means of scanning ultrasonic microscopy technique

G. De Liso, M. Muschitiello, M. Stucchi
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Volume:
15
Year:
1993
Language:
english
Pages:
7
DOI:
10.1002/sca.4950150410
File:
PDF, 1.75 MB
english, 1993
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