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A novel method of processing pulse echo data in adhesive bond inspection
E. Segal, P. Dickstein, Y. Segal, S. Kenig, H. DodiukVolume:
9
Language:
english
Pages:
17
DOI:
10.1007/bf00566978
Date:
March, 1990
File:
PDF, 1.58 MB
english, 1990