A study of the adhesion of copper to polyimide foils using...

Analytical and Bioanalytical Chemistry 1989 Vol. 333; Iss. 4-5

A study of the adhesion of copper to polyimide foils using surface analytical techniques

K. Horn, A. M. Bradshaw, K. Doblhofer, S. Krause, G. Weinberg, H. -M. Seidenspinner, R. Schulz
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Volume:
333
Year:
1989
Language:
english
Pages:
6
DOI:
10.1007/bf00572382
File:
PDF, 779 KB
english, 1989
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