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Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part I: Experimental analysis
P. T. Vianco, K. L. Erickson, P. L. HopkinsVolume:
23
Language:
english
Pages:
7
DOI:
10.1007/bf02651365
Date:
August, 1994
File:
PDF, 924 KB
english, 1994