Microstructure evolution of eutectic Sn-Ag solder joints

Journal of Electronic Materials 1994 / 08 Vol. 23; Iss. 8

Microstructure evolution of eutectic Sn-Ag solder joints

Wenge Yang, Robert W. Messler, Lawrence E. Felton
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Volume:
23
Language:
english
Pages:
8
DOI:
10.1007/bf02651371
Date:
August, 1994
File:
PDF, 2.99 MB
english, 1994
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