A viable tin-lead solder substitute: Sn-Ag-Cu

Journal of Electronic Materials 1994 / 07 Vol. 23; Iss. 7

A viable tin-lead solder substitute: Sn-Ag-Cu

Chad M. Miller, Iver E. Anderson, Jack F. Smith
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Volume:
23
Language:
english
Pages:
7
DOI:
10.1007/bf02653344
Date:
July, 1994
File:
PDF, 1.65 MB
english, 1994
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