Thermal analysis of a multi-chip package design

Journal of Electronic Materials 1989 / 03 Vol. 18; Iss. 2

Thermal analysis of a multi-chip package design

Robert Darveaux, Lih-Tyng Hwang, Arnold Reisman, Iwona Turlik
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Volume:
18
Language:
english
Pages:
8
DOI:
10.1007/bf02657418
Date:
March, 1989
File:
PDF, 809 KB
english, 1989
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