High rate magnetron RIE of thick polyimide films for advanced computer packaging applications
Giora J. Dishon, Stephen M. Bobbio, Ted G. Tessier, Yueh-Se Ho, Russell F. JewettVolume:
18
Language:
english
Pages:
7
DOI:
10.1007/bf02657421
Date:
March, 1989
File:
PDF, 2.10 MB
english, 1989