The microstructure, mechanical stress, texture, and...

Journal of Electronic Materials 1993 / 06 Vol. 22; Iss. 6

The microstructure, mechanical stress, texture, and electromigration behavior of Al-Pd alloys

K. P. Rodbell, D. B. Knorr, J. D. Mis
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Volume:
22
Language:
english
Pages:
10
DOI:
10.1007/bf02666404
Date:
June, 1993
File:
PDF, 1.30 MB
english, 1993
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