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Structural characterization of through silicon vias
Bender, H., Drijbooms, C., Marcke, P., Geypen, J., Philipsen, H. G. G., Radisic, A.Volume:
47
Language:
english
Pages:
8
Journal:
Journal of Materials Science
DOI:
10.1007/s10853-010-5144-6
Date:
September, 2012
File:
PDF, 540 KB
english, 2012