Growth mechanisms of interfacial intermetallic compounds in Sn/Cu–Zn solder joints during aging
Yu, Chi-Yang, Duh, Jenq-GongVolume:
47
Language:
english
Pages:
8
Journal:
Journal of Materials Science
DOI:
10.1007/s10853-012-6581-1
Date:
September, 2012
File:
PDF, 942 KB
english, 2012