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Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes
Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. Tan, J. WeiVolume:
23
Language:
english
Pages:
8
DOI:
10.1007/s10854-011-0557-9
Date:
May, 2012
File:
PDF, 506 KB
english, 2012