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Electroplated Indium Bumps as Thermal and Electrical Connections of NTD-Ge Sensors for the Fabrication of Microcalorimeter Arrays
U. Lo Cicero, C. Arnone, M. Barbera, A. Collura, G. LulloVolume:
167
Language:
english
Pages:
6
DOI:
10.1007/s10909-012-0560-4
Date:
May, 2012
File:
PDF, 472 KB
english, 2012