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Effect of Sn Grain Orientation on the Cu6Sn5Formation in a Sn-Based Solder Under Current Stressing
Lin, Chih-Fan, Lee, Shang-Hua, Chen, Chih-MingVolume:
43
Language:
english
Pages:
3
Journal:
Metallurgical and Materials Transactions A
DOI:
10.1007/s11661-012-1276-4
Date:
August, 2012
File:
PDF, 354 KB
english, 2012