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Effect of Pd Thickness on the Interfacial Reaction and Shear Strength in Solder Joints Between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Surface Finish
Young Min Kim, Jin-Young Park, Young-Ho KimVolume:
41
Language:
english
Pages:
11
DOI:
10.1007/s11664-012-1921-0
Date:
April, 2012
File:
PDF, 1.70 MB
english, 2012