Prevention of blister formation in electrolessly deposited...

Prevention of blister formation in electrolessly deposited copper film on organic substrates

Jung-Wook Seo, Hyo-Seung Nam, Seonhee Lee, Yong Sun Won
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Volume:
29
Language:
english
Pages:
5
DOI:
10.1007/s11814-011-0208-0
Date:
April, 2012
File:
PDF, 1.08 MB
english, 2012
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