Microstructure and thermal conductivity of copper matrix...

Rare Metals 2012 / 02 Vol. 31; Iss. 1

Microstructure and thermal conductivity of copper matrix composites reinforced with mixtures of diamond and SiC particles

Yuanyuan Han, Hong Guo, Fazhang Yin, Ximin Zhang, Ke Chu, Yeming Fan
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Volume:
31
Language:
english
Pages:
6
DOI:
10.1007/s12598-012-0463-1
Date:
February, 2012
File:
PDF, 449 KB
english, 2012
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