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Electrochemical migration behavior of Ag-plated Cu-filled electrically conductive adhesives
Xiaoyun Zhu, Yuanlong Liu, Jinming Long, Xiaoli LiuVolume:
31
Language:
english
Pages:
7
DOI:
10.1007/s12598-012-0464-0
Date:
February, 2012
File:
PDF, 708 KB
english, 2012