Experimental characterization and modeling of the...

Acta Materialia 2012 Vol. 60; Iss. 2

Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits

Riko I Made, Chee Lip Gan, Liling Yan, Katherine Hwee Boon Kor, Hong Ling Chia, Kin Leong Pey, Carl V. Thompson
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Volume:
60
Year:
2012
Language:
english
Pages:
10
DOI:
10.1016/j.actamat.2011.09.038
File:
PDF, 1.33 MB
english, 2012
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