Thermal conduction analysis and characterization of solder bumps in flip chip package
Xiangning Lu, Tielin Shi, Qi Xia, Guanglan LiaoVolume:
36
Year:
2012
Language:
english
Pages:
7
DOI:
10.1016/j.applthermaleng.2011.12.028
File:
PDF, 915 KB
english, 2012