Thermal conduction analysis and characterization of solder...

Thermal conduction analysis and characterization of solder bumps in flip chip package

Xiangning Lu, Tielin Shi, Qi Xia, Guanglan Liao
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Volume:
36
Year:
2012
Language:
english
Pages:
7
DOI:
10.1016/j.applthermaleng.2011.12.028
File:
PDF, 915 KB
english, 2012
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