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Metal–metal bonding process using metallic copper nanoparticles prepared in aqueous solution
Y. Kobayashi, T. Shirochi, Y. Yasuda, T. MoritaVolume:
33
Year:
2012
Language:
english
Pages:
6
DOI:
10.1016/j.ijadhadh.2011.11.002
File:
PDF, 1.15 MB
english, 2012