Combined ultrasonic vibration and chemical mechanical...

Combined ultrasonic vibration and chemical mechanical polishing of copper substrates

Ming-Yi Tsai, Wei-Zheng Yang
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Volume:
53
Year:
2012
Language:
english
Pages:
8
DOI:
10.1016/j.ijmachtools.2011.09.009
File:
PDF, 1.54 MB
english, 2012
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