Effect of electroless plating Ni–Cu–P layer on the...

Effect of electroless plating Ni–Cu–P layer on the wettability between cemented carbides and soldering tins

Liu Zhu, Laima Luo, Juan Luo, Jian Li, Yucheng Wu
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
31
Year:
2012
Language:
english
Pages:
4
DOI:
10.1016/j.ijrmhm.2011.11.002
File:
PDF, 514 KB
english, 2012
Conversion to is in progress
Conversion to is failed