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Effect of electroless plating Ni–Cu–P layer on the wettability between cemented carbides and soldering tins
Liu Zhu, Laima Luo, Juan Luo, Jian Li, Yucheng WuVolume:
31
Year:
2012
Language:
english
Pages:
4
DOI:
10.1016/j.ijrmhm.2011.11.002
File:
PDF, 514 KB
english, 2012