Evaluation of Cu as an interlayer in Be/F82H diffusion bonds for ITER TBM
R.M. Hunt, S.H. Goods, A. Ying, C.K. Dorn, M. AbdouVolume:
417
Year:
2011
Language:
english
Pages:
4
DOI:
10.1016/j.jnucmat.2010.12.168
File:
PDF, 818 KB
english, 2011